国际医疗器械设计与制造技术展览会

Dedicated to design & manufacturing for medical device

September 25-27,2024 | SWEECC H1&H2

EN | 中文
   

Technology Track D: Seminar of Advanced Technology of Medical Bonding and Welding

September 25, 2024 PM | Meeting Room B, Hall 1, Shanghai World Expo Exhibition & Convention Center, Shanghai, China

 

Background:

Due to the effective sealing, leak proof, disassembly poof and fewer use of parts realized by the combination of complete surfaces, consistency of the function and safety of medical products can be better ensured, welding and bonding are widely used. In particular, there are many medical products which can only be bonded or welded for the reason of small overall dimensions.

With the continuous development of medical device, requirements for bonding technology are getting higher. At the same time, the coating technology, which goes hand in hand with welding, will also affect quality of medical devices. How to choose appropriate processing technology for emerging devices? What innovative solutions bring for us? How new adhesives improve the quality of medical devices? At the conference, these issues will be discussed to clear up confusions of enterprises on production principles, process parameters and methods.

 

Participants:

  • Medical device manufacturers: heads of the departments of R&D, design, compliance, and technology, as well as project/company leaders
  • Product and solution providers of adhesives, solvent welding, ultrasonic welding, seal testing, coatings, etc.
  • Clinicians, laboratories and research organizations

 

Agenda:

Time

Agenda

13:20-13:30

Moderator Remarks

13:30-14:00

Advanced UV Curing Solutions for Medical Devices
Alders (Reserved)

14:00-14:30

Applications and Developments in Vision-guided Dispensing Technology
LPKF (Reserved)

14:30-15:00

The Role of Advanced Metallurgy and Coating in Smaller, Smarter Medical Devices

15:00-15:30

Ultrasonic Welding Technology

15:30-16:00

Application of Innovative Viscose Technology for Wearable Devices

16:00-16:10

Conference Close

*The agenda may be subject to changes due to adjustment of confirmed speakers

 

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