Seminar of Advanced Technology of Medical Bonding and Welding
Manufacturing Process Seminar of Advanced Technology of Medical Bonding and Welding September 25th, AM | Meeting Room B of Hall 1, Shanghai World Expo Exhibition & Convention Center, Shanghai, China Co-organizers:Medtec China |
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Background: Due to the effective sealing, leak proof, disassembly poof and fewer use of parts realized by the combination of complete surfaces, consistency of the function and safety of medical products can be better ensured, welding and bonding are widely used. In particular, there are many medical products which can only be bonded or welded for the reason of small overall dimensions. With the continuous development of medical device, requirements for bonding technology are getting higher. At the same time, the coating technology, which goes hand in hand with welding, will also affect quality of medical devices. Users face many confusions when selecting and applying adhesive bonding and welding technologies. Key concerns include choosing the right technique, ensuring reliable connections between dissimilar materials, evaluating the reliability of bonding or welding processes, and understanding the causes of connection failures in products. This conference will discuss these issues, aiming to address enterprises’ issues regarding production principles, process parameters, methods, and more. Participants:
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Time |
Agenda |
13:20-13:30 |
Moderator Remarks |
13:30-14:00 |
Advanced UV Curing Solutions for Medical Devices |
14:00-14:30 |
Applications And Developments in Vision-Guided Dispensing Technology |
14:30-15:00 |
Medical Adhesives and Their Applications in Medical Devices |
15:00-15:30 |
Precision Fitting and Laser Welding Process Parameter Control in Intelligent Assembly Systems |
15:30-16:00 |
Special Bonding and Welding Processes for Inert Materials< |
16:00-16:10 |
Conference Close |
*The agenda may be subject to changes due to adjustment of confirmed speakers. |
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